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Gijutsu gravure à sec Hajimete No Handotai, livre de poche par Nojiri, Kazuo, Like Ne...
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Lieu : Jessup, Maryland, États-Unis
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Numéro de l'objet eBay :364112925955
Dernière mise à jour : mai 04, 2024 14:05:22 HAEAfficher toutes les modificationsAfficher toutes les modifications
Caractéristiques de l'objet
- État
- ISBN
- 9783319356242
- Book Title
- Dry Etching Technology for Semiconductors
- Item Length
- 9.2in
- Original Language
- Japanese
- Publisher
- Springer International Publishing A&G
- Publication Year
- 2016
- Format
- Trade Paperback
- Language
- English
- Item Height
- 0.3in
- Genre
- Technology & Engineering, Science
- Topic
- Physics / Condensed Matter, Electronics / Semiconductors, Electronics / Microelectronics, Electronics / Circuits / General
- Item Width
- 6.1in
- Item Weight
- 74.7 Oz
- Number of Pages
- Xiii, 116 Pages
À propos de ce produit
Product Information
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc."
Product Identifiers
Publisher
Springer International Publishing A&G
ISBN-10
3319356240
ISBN-13
9783319356242
eBay Product ID (ePID)
239885004
Product Key Features
Book Title
Dry Etching Technology for Semiconductors
Original Language
Japanese
Format
Trade Paperback
Language
English
Topic
Physics / Condensed Matter, Electronics / Semiconductors, Electronics / Microelectronics, Electronics / Circuits / General
Publication Year
2016
Genre
Technology & Engineering, Science
Number of Pages
Xiii, 116 Pages
Dimensions
Item Length
9.2in
Item Height
0.3in
Item Width
6.1in
Item Weight
74.7 Oz
Additional Product Features
Number of Volumes
1 Vol.
Lc Classification Number
Tk7867-7867.5
Reviews
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc. , This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc., This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc."
Table of Content
Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit.- Mechanism of Dry Etching.- Dry Etching of Various Materials.- Dry Etching Equipments.- Dry Etching Damage.- Latest Dry Etching Technologies.- Future Challenges and Outlook for Dry Etching Technology.
Copyright Date
2015
Intended Audience
Trade
Illustrated
Yes
Description de l'objet du vendeur
Le vendeur assume l'entière responsabilité de cette annonce.
Numéro de l'objet eBay :364112925955
Dernière mise à jour : mai 04, 2024 14:05:22 HAEAfficher toutes les modificationsAfficher toutes les modifications
Expédition et manutention
Lieu où se trouve l'objet :
Jessup, Maryland, États-Unis
Expédition :
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Great seller! Item came in mint condition! Thanks!
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returned book - already had book with different cover, received refund, very satisfied
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It has been an extremely long time I still have not received the books I am about to give a super negative review I've ordered other stuff and have received it already these Miss Born books have not come and today was the last day on the shipment so I'm going to have to say this was badly done